|
PVA TePla/Technics 100-E Plasma Asher/Etcher Processor Comes with what you see in the pictures. If you don't see it, you probably wont get it. Specifications are from a 3rd party and may vary slightly due to upgrades, options, or revisions this unit may or may not have. The unit powers up and I was able to fire up the plasma (the chamber glowed purplish) using just Oxygen and the vacuum pump that came with the unit. I don't have any other way to test it after that. The unit has the Jet Blow Air Control option and the Faraday Cage (needed for that option). The Main Unit's Serial Number Tag Reads (Tag is really hard to read): Power Requirements: 220 V~, Single Phase, 60 Hz, 4 Amps The Vacuum Pump's Serial Number Tag Reads: Ultimate Pressure: < 1 x 10-4 mbar * Mist Filter CF 4-25, Catalog 10196 * Alumina Filter, Catalog Number: 189 96 Other processes, such as wet ashing with the help of oxidizing acids, have also been used successfully in low temperature ashing. However, they have the disadvantage compared to plasma ashing in that hte physical structure and crystalline phases are often destroyed. Also, oxidizing acids may themselves contain trace contaminants, which will affect the analysis. Plasma oxidation is a dry process, which prevents any contamination of the substance to be analyzed. Oxydation in oxygen plasma can be used for the following processes: * Ashing of organic matrices for analysis, structural analysis, or spectroscopic analysis of inorganic residues. * Surface cleaning of glass, metal, and ceramics. * Hydrophilization of plastic surfaces. * Preparation of specimens for electron microscopy. Plasma reactors have been successfully used for etching silicon and its compounds, as well as for photoresist stripping and surface cleaning. Gas molecules and atoms are activated by applying high frequency in the vacuum chamber at pressures of 0.2 - 1 mbar. The excited gas particles react with the substrates. This process makes it possible to create fine structures by a dry method or to remove organic deposits. The most frequently used gases are oxygen for removal of photoresist films, as well as CF4. These gases are most often used in mixtures with oxygen. The Model 100 Plasma Processor is used for the following processes: * Etching of SiO2, Si3N4, Si * Removal of polyimide films Height (Chamber Closed): 450 mm Height (Chamber Open): 610 mm Main Power Connection: 220 V, 50/60 Hz, 4 A Fuse, 1 kW Gas Connections: 2 process gases, inlet pressure 1 -3 bar 1/4" Swagelok Compressed Air COnnection: Inlet pressure 4 -6 bar (blow air) 1/4" Swagelog Hirschmann Socket: 24 VAC for solenoid connection. Material: Clean quartz with paint sheathing against ozone formation on the outside; gas inlet opening on the top Dimensions: 150 mm diameter, approx. 80 mm height Material: Clear quartz; chamber bottom of anodized aluminum; silicone rubber gaskets, 18 W lights Dimensions: 150 mm diameter, approx. 100 height Loading Door: 148 mm diameter. Inlet opening for blow gas in chamber bottom. Maximum Final Vacuum: 0.02 - 0.03 Torr Typical Operating Pressure: 0.4 - 1 Torr Operating Range of Plasma: 0.3 - 1.6 Torr for the usual process gases (O2, CF4, Ar, He, N2, etc.) Evacuation time to 0.4 Torr: Approx. 15 - 20 seconds The Vacuum Gauge: Thermoelement - vacuum, Measuring range from 0.01 Torr to 20 Torr Vacuum Connections: Corrosion - resistant aluminum fittings Number of Channels: Two separate gas channels for mixing gases, per gas channel - one solenoid valve and one controlled - flow needle valve Material: Brass, three - digit display in needle valve rotary knob Max. Flow: Approx. 200 ml/min. at 2.5 bar inlet pressure Connection Hoses: Polyethylene connecting hoses. Venting: Through a brass needle valve and a solenoid valve Magnetron: HF Power 300 Watt max., air-cooled, indicating instrument of 0 - 400 Watt, power continuously adjustable between 50 and 300 W. Overload Protection: Red LED and reset button Indicator for High Voltage Power Supply: Yellow LED For More Pictures Please Click the Following: * Picture 2 - Front View, Plasma Etcher * Picture 3 - Back View, Plasma Etcher * Picture 4 - Front View, Vacuum Pump * Picture 5 - Top of the Chamber * Picture 6 - Bottom of the Chamber * Picture 8 - View Window with Plasma Lit Up * Picture 9 - Power Meter with Plasma Lit Up #1 * Picture 10 - Power Meter with Plasma Lit Up #2 * Picture 11 - Power Meter, Controls & Indicators * Picture 12 - Vacuum/Time Meters & Controls * Picture 13 - Gas Supply Controls & Vent * Picture 14 - Illumination Control & Elapsed Timer * Picture 15 - Jet-Blow Controls * Picture 16 - Vacuum, Gas, Vent, Blow Connections on Back * Picture 17 - Fiber Optic View Port? (this posting is the responsibility of the poster) |
Cbarton@dfwind.com (Concetta Barton) for more information. All emails will be forwarded to the poster's actual email address.
