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2. Eight pre-set heat reflow temperature waveforms/curves for selection. Manual heating and forced cooling functions are also available. 3. Easy operation. The whole SMD/BGA soldering process is done automatically. 4. Infrared and hot air heating. Temperature is more accurate and even. 5. Fuzzy temperature control and transparent drawer. 6. Can solder small SMT components. Can also be used for CHIP, SOP, PLCC, QFP single and double sided PCB soldering. 8. Max temperature that can be set is 280C. â—† Voltage: 220V /110V AC +-10% (specify at checkout) â—† Output power: 800W â—† Dimension: 310 x 290 x 170 mm. â—† Weight: 7kg approx. â—† Work cycle: 1 to 8 min. â—† Effective soldering area: 180 x 235 mm. 1. International: 85Sn/15Pb 70Sn/30Pb 2. International: 63Sn/37Pb 60Sn/40Pb 3. American: Sn/Ag3.5 Sn/Cu.75 Sn/Ag4.0/Cu.5 4. American: Sn/Ag2.5/Cu.8/Sb.5 Sn/Bi3.0/Ag3.0 7 & 8: User-defined temperature curves. One spare heating element is included. Just add USD27 for an additional spare heating element when purchasing with the machine! (this posting is the responsibility of the poster) |
eleanor_velazquez@dfwind.com (Eleanor Velazquez) for more information. All emails will be forwarded to the poster's actual email address.
