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· Black diamond is standard low K material of semiconductor industry for 65nm and 45nm node microchip manufacturing technology. · Black Diamond I layer on the single crystal silicon wafer. The thickness of Black Diamond is above 9000A. · It has been fine polished on one side · Smooth mirror surface with nanometer level surface roughness. · Great to be used as gift, display object, exhibition, educating demonstration, testing, decoration or your collection. · The wafer looks like new and is well packaged so that you could use it as research too. · You should keep the wafer in a clean, dry condition to avoid the surface pollution. The Wafer is very fragile, a broken wafer can be dangerous due to the sharp edges can cause injuries. Consider it as thin glassware, handle and display it with care. Keep away to the children. We will pack it very well for transport. PLEASE LET US KNOW IF YOU NEED MULTIPLE QTY OF THIS ITEM. (this posting is the responsibility of the poster) |
susan-kemp@dfwind.com (Susan Kemp) for more information. All emails will be forwarded to the poster's actual email address.
